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Safe Transport Solution for Thin Wafers in Cleanroom Environments

Individually developed custom solution to reduce breakage and damage during internal transport.

Initial Situation


During internal transport of thin wafers, repeated breakage and damage occurred. The causes were vibrations, insufficient fixation, and transport solutions that were not optimally aligned with the existing process. Standard products did not provide the required stability and safety for these highly sensitive components.

Requirements for the Solution



    Minimization of vibrations during transport

    Secure and material-friendly holding of thin wafers

    Cleanroom-compatible, low-abrasion materials

    Ergonomic handling for operating personnel

    Adaptation to existing transport routes and processes


Our Solution and the Resulting Benefits


In close coordination with the customer, a low-vibration, cleanroom-compatible transport solution was developed. Construction, material selection, and manufacturing were precisely aligned with the existing process and the sensitive components.

1

Significant Reduction of Thin Wafer Breakage

Low-vibration transport and secure fixation significantly minimize damage.

2

Improved Process Reliability in the Cleanroom

Materials and construction are fully optimized for cleanroom applications.

3

Long-Term Reduction of Scrap and Downtime Costs

Reduced breakage and more stable processes lower costs and minimize unplanned interruptions.