Safe Transport Solution for Thin Wafers in Cleanroom Environments
Individually developed custom solution to reduce breakage and damage during internal transport.
Initial Situation
During internal transport of thin wafers, repeated breakage and damage occurred. The causes were vibrations, insufficient fixation, and transport solutions that were not optimally aligned with the existing process. Standard products did not provide the required stability and safety for these highly sensitive components.
Requirements for the Solution
Minimization of vibrations during transport
Secure and material-friendly holding of thin wafers
Cleanroom-compatible, low-abrasion materials
Ergonomic handling for operating personnel
Adaptation to existing transport routes and processes
Our Solution and the Resulting Benefits
In close coordination with the customer, a low-vibration, cleanroom-compatible transport solution was developed. Construction, material selection, and manufacturing were precisely aligned with the existing process and the sensitive components.
Significant Reduction of Thin Wafer Breakage
Low-vibration transport and secure fixation significantly minimize damage.
Improved Process Reliability in the Cleanroom
Materials and construction are fully optimized for cleanroom applications.
Long-Term Reduction of Scrap and Downtime Costs
Reduced breakage and more stable processes lower costs and minimize unplanned interruptions.


